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Job Description and Jobs

Job Description:

  • 1) Tends abrading machines that polish or lap surface of semiconductor wafers: Reads work order to determine specifications.

  • 2) Loads wafers or carriers containing wafers onto polishing or lapping machine.

  • 3) Adjusts machine controls or loads programmed control media in machine to regulate pressure, time, and slurry flow.

  • 4) Starts lapping machine that removes saw marks and reduces wafer thickness or starts polishing machine that polishes wafers.

  • 5) Observes machine operation and listens to sounds of belts, cams, and abrading wheel to detect machine malfunctions.

  • 6) Adjusts mechanisms or requests repairs as necessary.

  • 7) Stops machine at prescribed time, removes wafers from machine, and rinses wafers with water to cool wafers and remove slurry.

  • 8) Examines wafers for defects, and measures wafer thickness, using thickness gauge.

  • 9) May clean wafers, using chemical solutions, water, or gases, to remove contaminants from wafer surface.

  • 10) May mount wafers onto carriers.

  • 11) May mix slurry.

  • 12) May tend machine that rounds wafer edges and be designated Edge-Round Tender.

  • 13) May be designated according to machine tended as Lapping Machine Tender.




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End Of Job Description for: "POLISHING MACHINE TENDER"
DOT:   673.685-094

Job Number: 7688