"DIE ATTACHING MACHINE TENDER"
Job Description and Jobs
Job Description:
- 1) Tends die attaching machine that bonds dies to semiconductor packages: Loads package carriers, magazines containing dies, and gold pieces, used to attach dies to packages, into designated slots of machine.
- 2) Starts machine that automatically positions and melts gold on packages and positions dies in packages to form assembled semiconductor packages.
- 3) Observes operation of machine to ensure that alignment of packages, gold, and dies meets company specifications, using video monitor.
- 4) Turns knobs on machine to adjust alignment of parts assembled, regulate operation speed, and set temperature of molten gold.
- 5) Removes magazines of packages for further processing.
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DOT: 726.685-026
Job Number: 2869