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Job Description:

  • 1) Tends automatic bonding machine that bonds gold or aluminum wire to integrated circuit dies to connect circuitry to package leads: Reviews schematic diagram or work order to determine bonding specifications.

  • 2) Turns dials to set bonding machine temperature controls and to regulate wire feeding mechanism.

  • 3) Mounts spool of wire onto holder and inserts wire end through guides, using tweezers.

  • 4) Positions semiconductor package into magazine of automatic feed mechanism, and observes package, using microscope or equipment display screen, to ensure connections to be bonded are aligned with bonding wire.

  • 5) Adjusts alignment as necessary.

  • 6) Activates machine that automatically bonds wire to specified connections on semiconductor package leads.

  • 7) Removes packages from bonding machine and places packages in work tray.

  • 8) May test tensile strength of bonded connections, using testing equipment.

  • 9) May locate connections and bond wire to connect circuitry of hybrid circuits, using precision-bonding machine.




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End Of Job Description for: "BONDER, SEMICONDUCTOR"
DOT:   726.685-066

Job Number: 964