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"METALLIZATION EQUIPMENT TENDER, SEMICONDUCTORS"
Job Description and Jobs

Job Description:

  • 1) Tends equipment that deposits layer of metal on semiconductor surfaces to provide electrical contact between circuit components: Places semiconductors, such as silicon wafers, crystal units, or fiber optic microchannel plates, in container, using vacuum wand or tweezers.

  • 2) Cleans semiconductors to remove contaminants prior to metal deposition, using chemical baths or automatic cleaning equipment.

  • 3) Loads semiconductors into metallization equipment holders, using vacuum wand or tweezers.

  • 4) Places loaded holders and specified metals in chamber of equipment that deposits layer of metal, such as aluminum, gold, or platinum, on semiconductor surfaces, by sputtering or evaporation process.

  • 5) Manipulates equipment controls that start and adjust metallization process, following processing specifications.

  • 6) Measures electrical conductivity and thickness of metal layer on processed semiconductors, using test equipment.

  • 7) Maintains chemicals and metals for equipment.

  • 8) May tend equipment that deposits insulating layer of glass onto semiconductor wafer surfaces and be designated Glass Deposition Tender.

 

 

 


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End Of Job Description for: "METALLIZATION EQUIPMENT TENDER, SEMICONDUCTORS"
DOT:   590.685-086

Job Number: 6433