Job Description:

• 1) Inspects semiconductor wafers, using microscope, to identify processing defects: Places wafers on stage of microscope, using tweezers or vacuum wand.

• 2) Examines surface of wafer and test patterns on wafers, using microscope, and compares wafers to specification diagrams to identify processing defects, such as scratches, contamination, pattern misalignment, photoresist peel, and circuit bridges.

• 3) Measures specified dimensions of test patterns on wafers, using electronic measuring devices attached to microscope at work station, to verify that wafers meet company specifications.