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"WAFER BREAKER, SEMICONDUCTORS"
Job Description and Jobs

Job Description:

  • 1) Breaks semiconductor wafers into individual dies, using equipment and handtools: Places semiconductor wafer on pad, using tweezers.

  • 2) Taps wafer, using pencil tip, awl, or tweezers to break wafer into quarters.

  • 3) Places semiconductor wafer quarter on plastic square.

  • 4) Presses semiconductor wafer, using roller or air pressure equipment, to break wafer quarter into individual dies.

  • 5) Places individual dies in containers, using vacuum wand or brush.

  • 6) May break wafers, using chemical solutions and breaking equipment.

 

 

 


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End Of Job Description for: "WAFER BREAKER, SEMICONDUCTORS"
DOT:   726.687-046

Job Number: 11776