"POLISHING MACHINE TENDER"
Job Description and Jobs
Job Description:
- 1) Tends abrading machines that polish or lap surface of semiconductor wafers: Reads work order to determine specifications.
- 2) Loads wafers or carriers containing wafers onto polishing or lapping machine.
- 3) Adjusts machine controls or loads programmed control media in machine to regulate pressure, time, and slurry flow.
- 4) Starts lapping machine that removes saw marks and reduces wafer thickness or starts polishing machine that polishes wafers.
- 5) Observes machine operation and listens to sounds of belts, cams, and abrading wheel to detect machine malfunctions.
- 6) Adjusts mechanisms or requests repairs as necessary.
- 7) Stops machine at prescribed time, removes wafers from machine, and rinses wafers with water to cool wafers and remove slurry.
- 8) Examines wafers for defects, and measures wafer thickness, using thickness gauge.
- 9) May clean wafers, using chemical solutions, water, or gases, to remove contaminants from wafer surface.
- 10) May mount wafers onto carriers.
- 11) May mix slurry.
- 12) May tend machine that rounds wafer edges and be designated Edge-Round Tender.
- 13) May be designated according to machine tended as Lapping Machine Tender.
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DOT: 673.685-094
Job Number: 7688