Job Description:

• 1) Breaks semiconductor wafers into individual dies, using equipment and handtools: Places semiconductor wafer on pad, using tweezers.

• 2) Taps wafer, using pencil tip, awl, or tweezers to break wafer into quarters.

• 3) Places semiconductor wafer quarter on plastic square.

• 4) Presses semiconductor wafer, using roller or air pressure equipment, to break wafer quarter into individual dies.

• 5) Places individual dies in containers, using vacuum wand or brush.

• 6) May break wafers, using chemical solutions and breaking equipment.