Job Description:

• 1) Cleans assembled semiconductor packages, coats package leads with flux, and applies solder to package leads, using solder dip machine, to complete semiconductor package assembly: Places packages in holding cases and immerses cases in series of acid baths to clean packages.

• 2) Places packages in holding fixtures and immerses loaded fixtures in flux bath to coat leads of packages.

• 3) Pushes button to activate solder pumps of solder-dip machine and places loaded fixtures on conveyor of machine that deposits solder on leads of packages to enhance electrical conductivity of leads.

• 4) Removes fixtures from conveyor, inspects leads of packages for uniform soldering, and removes solder from top of packages, using needle-nose pliers.

• 5) Places loaded fixtures in baskets and immerses baskets in series of acid and soap baths to clean packages.

• 6) Removes packages from fixtures, places packages on trays, and positions loaded trays in oven to dry packages.

• 7) Removes tray from oven and loads packages into lot box and cleans and maintains solder pot of machine.

• 8) Maintains production records.