Job Description:

• 1) Tends sawing machine that automatically scribes semiconductor wafers prior to separating wafers into individual dies: Flips switches and presses buttons to activate sawing machine.

• 2) Places wafer mounted on laminated plastic onto moveable chuck of sawing machine, using tweezers.

• 3) Presses buttons and turns knobs and dials to adjust saw to specifications and to start sawing cycle.

• 4) Monitors sawing cycle, using magnified viewer or TV monitor, to verify that wafers are scribed according to specifications and adjusts controls if required.

• 5) Removes scribed wafer from machine and places wafer in container, using tweezers.

• 6) May mount wafers on plastic laminate, using mounting device.

• 7) May visually inspect wafers to identify misalignment of scribe lines.

• 8) May maintain and clean sawing machine.

• 9) May separate sawn wafers into dies.

• 10) May clean sawn wafers or dies, using cleaning equipment and solutions.