Job Description:

• 1) Tends abrading machines that polish or lap surface of semiconductor wafers: Reads work order to determine specifications.

• 2) Loads wafers or carriers containing wafers onto polishing or lapping machine.

• 3) Adjusts machine controls or loads programmed control media in machine to regulate pressure, time, and slurry flow.

• 4) Starts lapping machine that removes saw marks and reduces wafer thickness or starts polishing machine that polishes wafers.

• 5) Observes machine operation and listens to sounds of belts, cams, and abrading wheel to detect machine malfunctions.

• 6) Adjusts mechanisms or requests repairs as necessary.

• 7) Stops machine at prescribed time, removes wafers from machine, and rinses wafers with water to cool wafers and remove slurry.

• 8) Examines wafers for defects, and measures wafer thickness, using thickness gauge.

• 9) May clean wafers, using chemical solutions, water, or gases, to remove contaminants from wafer surface.

• 10) May mount wafers onto carriers.

• 11) May mix slurry.

• 12) May tend machine that rounds wafer edges and be designated Edge-Round Tender.

• 13) May be designated according to machine tended as Lapping Machine Tender.