Job Description:

• 1) Electroplates semiconductor wafers and electronic components, such as copper leads and rectifiers, with metals, such as gold, silver, and lead: Reads processing sheet to determine plating time and specifications.

• 2) Places components or wafers in basket or fixture, using tweezers, and immerses components or wafers in chemical solution baths for specified time to clean and plate components or wafers.

• 3) May measure thickness of photoresist and metal on wafer surface, using micrometer, and test electrical circuitry of individual die on wafer, using test probe equipment.

• 4) May measure anode width on wafer surface, using microscope measuring equipment.