Job Description:

• 1) Tends plasma equipment that dry etches unprotected copper from substrate boards or panels to form circuit patterns on printed circuit boards: Hangs boards or panels on racks in plasma tank and locks door.

• 2) Adjusts controls, according to process specifications, to set time, wattage, and percentage of oxygen and nitrogen gases in plasma tank.

• 3) Pushes button to activate equipment that automatically plasma-etches excess copper from boards or panels to form circuit pattern.

• 4) Removes boards or panels after processing and inspects boards for completeness of etching process, using microscope.

• 5) May tend computer-controlled plasma etch equipment that automatically computes and adjusts control settings for time, wattage, and gas content based on data entered, such as quantity of boards and lot number.