Job Description:

• 1) Tends equipment that deposits layer of metal on semiconductor surfaces to provide electrical contact between circuit components: Places semiconductors, such as silicon wafers, crystal units, or fiber optic microchannel plates, in container, using vacuum wand or tweezers.

• 2) Cleans semiconductors to remove contaminants prior to metal deposition, using chemical baths or automatic cleaning equipment.

• 3) Loads semiconductors into metallization equipment holders, using vacuum wand or tweezers.

• 4) Places loaded holders and specified metals in chamber of equipment that deposits layer of metal, such as aluminum, gold, or platinum, on semiconductor surfaces, by sputtering or evaporation process.

• 5) Manipulates equipment controls that start and adjust metallization process, following processing specifications.

• 6) Measures electrical conductivity and thickness of metal layer on processed semiconductors, using test equipment.

• 7) Maintains chemicals and metals for equipment.

• 8) May tend equipment that deposits insulating layer of glass onto semiconductor wafer surfaces and be designated Glass Deposition Tender.