Job Description:

• 1) Loads dies, using vacuum wand, into carriers that hold and protect dies during fabrication of semiconductor packages: Pours dies from container onto filter paper.

• 2) Picks up and places dies circuit-side up in indentations in carrier, using vacuum wand.

• 3) Secures lid on carrier, using manual pressure.

• 4) May clean dies prior to loading, using solutions and cleaning equipment.

• 5) May sort semiconductor devices to remove defective devices marked in inspection department.