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"LEAD WORKER, WAFER POLISHING"
Job Description and Jobs

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Job Description:

  • 1) Assists SUPERVISOR, ELECTRONICS PROCESSING in coordinating activities of workers engaged in polishing wafers for use in manufacturing semiconductor devices: Reviews production goals with SUPERVISOR, ELECTRONICS PROCESSING, prioritizes wafers to be polished, and assigns workers to stations.

  • 2) Monitors production and adjusts work assignments when necessary.

  • 3) Inspects polished wafers and measures wafer thickness, using gauge, to ensure conformance to customer specifications.

  • 4) Trains workers in equipment operation and wafer inspection.

  • 5) Observes workers to ensure compliance with safety rules and production standards.

  • 6) Completes work schedules and daily production reports.

  • 7) May tend polishing machines to substitute for workers during worker absence or to relieve bottlenecks in work congested areas.



 

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End Of Job Description for: "LEAD WORKER, WAFER POLISHING"
DOT:   673.364-010



 


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