Job Description:

• 1) Tends etch machine and equipment that remove metal and photoresist and etches electronic circuitry into metallized substrate of wafer surface, according to processing specifications: Places wafers in boats, using tweezers or vacuum wand.

• 2) Places boats in etch machine or equipment.

• 3) Turns dials, sets timer and gauges on equipment, or presses buttons on machine to activate etch cycle to etch or remove materials from wafer surface, such as metal or photoresist.

• 4) Inspects wafer to verify that wafers are not over-etched and that photoresist has been removed, using microscope.

• 5) May measure specified dimensions of wafers, using microscope measuring attachment.

• 6) May manually immerse loaded boats into chemical solution baths to etch circuitry into wafer surface.