Job Description:

• 1) Performs any combination of following tasks to encapsulate electrical and electronic parts, components, and assemblies with epoxy, plastic, and other protective coating material: Weighs and mixes encapsulating material, following prescribed formula.

• 2) Positions module or transformer case under outlet of encapsulating fluid tank and moves controls to force preset amount of fluid from tank into module or transformer case.

• 3) Places components on racks or hooks, dips racks or hooks containing components into encapsulating fluid, and places dipped components on drying frame or into oven to harden coating.

• 4) Fills capacitor shells or semiconductor caps with encapsulating fluid or applies encapsulating fluid to specified surfaces on component, using manually- or electrically-powered syringe or other applicator.

• 5) Molds protective casing around component, using compression molding machine.

• 6) Places component into mold and pours encapsulating fluid into mold to surround component.

• 7) Heats component in oven or curing device prior to or after encapsulating to remove moisture or cure encapsulating material.

• 8) Inspects encapsulation for defects, such as chips and pinholes.

• 9) Stamps color code or trademark on encapsulated components.

• 10) Bonds flexible printed circuit boards to rigid boards, using bonding solution and potting equipment.

• 11) May weigh and mix materials, following formula, and be designated Compound Mixer.

• 12) May be designated Bonder; Dipper; Filler; Potter.