Job Description:

• 1) Tends die attaching machine that bonds dies to semiconductor packages: Loads package carriers, magazines containing dies, and gold pieces, used to attach dies to packages, into designated slots of machine.

• 2) Starts machine that automatically positions and melts gold on packages and positions dies in packages to form assembled semiconductor packages.

• 3) Observes operation of machine to ensure that alignment of packages, gold, and dies meets company specifications, using video monitor.

• 4) Turns knobs on machine to adjust alignment of parts assembled, regulate operation speed, and set temperature of molten gold.

• 5) Removes magazines of packages for further processing.