Job Description:

• 1) Attaches dies to empty integrated circuit packages to assemble complete semiconductor packages, using welding and gluing equipment: Places empty IC packages on heated chuck of equipment, using tweezers.

• 2) Deposits bonding material, such as epoxy or gold alloy, on specified location of empty packages, and positions and aligns dies on bonding material in packages, using equipment or handtools.

• 3) Removes packages with attached dies from chuck and places packages in trays, using tweezers.

• 4) May place loaded trays in oven to set bonding material.

• 5) May view positioning of epoxy and die in empty packages through microscope.