Job Description:

• 1) Operates precision saws to slice wafers from semiconductor crystal ingots, such as silicon or gallium arsenide: Attaches mounted crystal to holding fixture of automatic feed on saw, using clamps.

• 2) Adjusts saw controls to set speed and angle of saw blade, thickness of cut, and angle of holding fixture.

• 3) Operates saw to cut sample wafer from crystal ingot.

• 4) Measures crystal orientation of sample wafer, using x-ray machine, and measures thickness of sample wafer, using calipers or thickness gauge.

• 5) Inspects sample wafer for flaws, such as saw marks, chips, bow, and taper.

• 6) Readjusts saw controls based on measurements and inspection.

• 7) Starts saw and observes operation of saw to ensure wafers are sliced according to specifications.

• 8) Removes sliced wafers from saw and cleans wafers in sink or ultrasonic cleaner.

• 9) May mount crystal ingot to mounting block.

• 10) May be designated according to type of saw operated as V-Block Saw Operator; Wire Saw Operator.