Job Description:

• 1) Operates grinding machine to abrade semiconductor crystal ingot to improve cylindrical shape of ingot and attain specified diameter: Reads work order to determine target diameter of ingot.

• 2) Measures ingot diameter, using calipers or micrometer, and calculates thickness of material to be removed from ingot and length of grinding time.

• 3) Positions and secures ingot in trunnions or brackets on grinding machine.

• 4) Adjusts machine controls for position of grinding tool and speed of grinding.

• 5) Pushes buttons to activate coolant flow, rotation of ingot, grinding tool, and timer.

• 6) Measures ingot diameter after grinding and continues grinding to attain specifications for diameter.

• 7) May change worn grinding tools and other parts and adjust machine, using handtools.

• 8) May attach graphite pieces to ends of ingot before grinding, using epoxy, and remove graphite and epoxy from ingot after grinding, using radiant oven and solvent.

• 9) May operate saw to cut sample wafer from ingot for inspection.

• 10) May perform routine maintenance on grinding machine, such as adding oil and cleaning machine.

• 11) May operate flat grinding machine to grind flat along length of ingot and be designated Crystal Flat Grinder.