Job Description:

• 1) Tends automatic bonding machine that bonds gold or aluminum wire to integrated circuit dies to connect circuitry to package leads: Reviews schematic diagram or work order to determine bonding specifications.

• 2) Turns dials to set bonding machine temperature controls and to regulate wire feeding mechanism.

• 3) Mounts spool of wire onto holder and inserts wire end through guides, using tweezers.

• 4) Positions semiconductor package into magazine of automatic feed mechanism, and observes package, using microscope or equipment display screen, to ensure connections to be bonded are aligned with bonding wire.

• 5) Adjusts alignment as necessary.

• 6) Activates machine that automatically bonds wire to specified connections on semiconductor package leads.

• 7) Removes packages from bonding machine and places packages in work tray.

• 8) May test tensile strength of bonded connections, using testing equipment.

• 9) May locate connections and bond wire to connect circuitry of hybrid circuits, using precision-bonding machine.