Job Description:

• 1) Assembles microelectronic semiconductor devices, components, and subassemblies according to drawings and specifications, using microscope, bonding machines, and handtools, performing any combination of following duties: Reads work orders and studies assembly drawings to determine operation to be performed.

• 2) Observes processed semiconductor wafer under scribing machine microscope and aligns scribing tool with markings on wafer.

• 3) Adjusts scribing machine controls, according to work order specifications, and presses switch to start scribing.

• 4) Removes scribed wafer and breaks wafer into dice, using probe.

• 5) Places dice under microscope, visually examines dice for defects, according to procedures, and rejects defective dice.

• 6) Positions mounting device on holder under bonding machine microscope, and adjusts bonding machine controls according to work order specifications.

• 7) Positions die on mounting surface according to diagram.

• 8) Presses switch on bonding machine to bond die to mounting surface.

• 9) Places mounted die into holding fixture under microscope of lead bonding machine.

• 10) Adjusts bonding machine controls according to work order specifications.

• 11) Views die and moves controls to align and position bonding head for lead bonding according to diagram.

• 12) Presses switch to bond lead and moves bonding head to points indicated in bonding diagram to attach and route leads as illustrated.

• 13) Inserts and seals unprotected assembly into designated assembly container device, using welding machine and epoxy syringe, to protect microelectronic assembly and complete device, component, or subassembly package.

• 14) Examines and tests assembly at various stages of production, using microscope, go-not-go test equipment, measuring instruments, pressure-vacuum tanks, and related devices, according to standard procedures, to detect nonstandard or defective assemblies.

• 15) Rejects or routes nonstandard components for rework.

• 16) Cleans parts and assemblies at various stages of production, using cleaning devices and equipment.

• 17) Maintains records of production and defects.

• 18) Bonds multiple dice to headers or other mounting devices.

• 19) Important variations are kinds of equipment used, such as thermal compression, wedge, wire ball, and wobble bonders, items assembled, or procedure performed.