Job Description:

• 1) Tends equipment that cleans surface of semiconductor wafers after slicing or polishing: Reviews work orders to determine processing steps.

• 2) Sets temperature controls on automatic chemical cleaning machine or sinks of chemical cleaning station.

• 3) Places containers of semiconductor wafers into drum of cleaning machine or into heated sinks of solutions in cleaning station to remove dust, oil, wax, slurry, or debris from surface of wafers.