Job Description:

• 1) Tends abrading machines that roughen surface of semiconductor wafers to distinguish front from back: Adjusts controls to set speed, time, and pressure of abrading belts according to specifications.

• 2) Loads container of wafers into abrading machine and starts machine that automatically abrades surface of wafer.

• 3) Removes abraded wafers from machine and inspects wafers to detect abrading defects, such as cracks, using microscope.