"SAW OPERATOR, SEMICONDUCTOR WAFERS"
Job Description and Jobs
Job Description:
- 1) Tends sawing machine that automatically scribes semiconductor wafers prior to separating wafers into individual dies: Flips switches and presses buttons to activate sawing machine.
- 2) Places wafer mounted on laminated plastic onto moveable chuck of sawing machine, using tweezers.
- 3) Presses buttons and turns knobs and dials to adjust saw to specifications and to start sawing cycle.
- 4) Monitors sawing cycle, using magnified viewer or TV monitor, to verify that wafers are scribed according to specifications and adjusts controls if required.
- 5) Removes scribed wafer from machine and places wafer in container, using tweezers.
- 6) May mount wafers on plastic laminate, using mounting device.
- 7) May visually inspect wafers to identify misalignment of scribe lines.
- 8) May maintain and clean sawing machine.
- 9) May separate sawn wafers into dies.
- 10) May clean sawn wafers or dies, using cleaning equipment and solutions.
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DOT: 726.685-046
Job Number: 8988